Ball Grid Arrays

During PCB assembly and manufacturing, Ball Grid Arrays (BGAs) may need to be re-balled, from time to time. Sometimes a BGA may get damaged or a cold solder or bridge is created, which require depopulating the BGA for BGA Rework. The EMS provider should have certain capabilities and experience to deal with this issue. Those capabilities involve Printed Circuit Board materials, BGA placement systems, and specific BGA rework systems.

BGA Rework Services Offered

• BGA Remove and Placement
• Level Three Pad Repair
• Wire Add
• Trace Repair
• BGA Re-Balling
• BGA Inspection

California PCB Assembly Rework

• PBGA (Plastic Ball Grid Array)
• TBGA (Tape Ball Grid Array)
• uBGA (Micro BGA)
• CCGA (Ceramic Column Grid Array)
• CBGA (Ceramic Ball Grid Array)
• CPGA (Ceramic Pin Grid Array)
• Interposers
• Double stacked components
• Ball Grid Array Connectors
• Grounded QFP (Quad Flat Pack)
• Grounded SOIC (Small Outline Plastic Packages)
• Lead Free BGA (Ball Grid Array