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California PCB Assembly didn't invent the Printed Circuit Board, but...
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Flex and Rigid-Flex PCBs are essentially hybrids of ordinary PCBs
California PCB Assembly has released new version of its popular electronics PCB design system.
California PCB Assembly announced today that the company obtained its ISO 9001:2008 certificate.
The introduction of Pb-Free assembly has been challenging for first-pass assembly, but even more challenges present themselves when PCB assembly rework is required. PCB repair in a Pb-Free environment can engender issues of cost, quality, timing and repeatability - all exaggerated because of Pb-Free demands.
California PCB Assembly believes in best practices for PCB assembly rework, which recommend providing Pb-free training kits to aid in instructing technicians and developing profiles. Accurate and reliable reworks are more difficult in a PB-free environment because the PCB and the components closest to the part needing repair must endure several cycles of higher temperatures. To protect the PCB laminate, the preheat temperature should be set no higher than 10°C below the glass transition temperature (Tg) of the PCB material. Higher temperatures may be required for thicker Circuit Boards with greater Delta T across assemblies. Increased temperatures during this process means you may have to slow down the oven line speed during re-flow. All of these considerations require careful planning and adaptations and OEM carefully plans for all exigencies during each step in your project.
Once the rework parameters have been defined, the process begins the same whether it requires standard or Pb-free solder - the required steps are:
The next steps involved in the rework process vary depending on whether or not there is a Pb-free requirement. The differences in standard vs. Pb-free present a number of challenges that can only be resolved by introducing new or altered processes including tighter, more accurate thermal profiles and extreme precision throughout the PCB rework procedures. This will avoid a number of costly problems that can result from the varying thermal profiles. California PCB Assembly implements the best practices procedures required to avoid errors such as blowholes on your Ball Grid Array ball, the separation of PCB substrate for the GA balls or micro-cracks from too much thermal stress.